LED arrays generate up to 150°C heat fluxes at LGP edges. Graphene-copper heat spreaders with 500W/m·K conductivity reduce hotspot temperatures by 40%. Simulation shows these spreaders maintain <5°C ΔT across 65-inch LGPs.

Microfluidic cooling channels integrated into LGPs circulate dielectric fluids. Tests demonstrate a 30% reduction in operating temperature for 100W LED modules. These systems require <5W pump power, adding minimal parasitic loss.

Finite element analysis (FEA) models predict warpage under thermal cycling. By optimizing asymmetric rib structures, LGPs maintain flatness <1mm over -40°C to 85°C cycles. This is critical for automotive displays operating in extreme climates.

For flexible LGPs, phase change materials (PCMs) embedded in polymer matrices absorb thermal spikes. These materials store 200J/g latent heat, preventing delamination during soldering processes.